ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,528,489, issued on Jan. 20, was assigned to TOYOTA JIDOSHA K.K. (Toyota, Japan). "Server apparatus, system, and operating method of system" was... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,530,424, issued on Jan. 20, was assigned to KOREA ATOMIC ENERGY RESEARCH INSTITUTE (Daejeon, South Korea). "Deep learning system for finite ele... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. D1,109,645, issued on Jan. 20, was assigned to Electro & Co. Inc. (Cool, Calif.). "Motorcycle frame" was invented by Austin Cantalini (Cool, Calif... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,226, issued on Jan. 20, was assigned to Panasonic Intellectual Property Corporation of America (Torrance, Calif.). "Communication apparatus... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,531,103, issued on Jan. 20, was assigned to NXP USA Inc. (Austin, Texas). "Management of refresh operations in an embedded dynamic random acces... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. D1,109,581, issued on Jan. 20, was assigned to Fiskars Finland Oy Ab (Espoo, Finland). "Axe grip" was invented by Sami Lyytikainen (Espoo, Finland... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,531,988, issued on Jan. 20, was assigned to LG Electronics Inc. (Seoul, South Korea). "Image coding method on basis of non-separable secondary ... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,007, issued on Jan. 20, was assigned to Skydio Inc. (San Mateo, Calif.). "Systems and methods for adapting unmanned aerial vehicle video st... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,529,913, issued on Jan. 20, was assigned to Essilor International (Charenton-le-Pont, France). "Method for reducing near-infrared light exposur... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,416, issued on Jan. 20, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo). "Thermally improved PCB for semiconductor power die connected by... Read More